Re: very very good OCing guide for C2D's
Thermal Specification: The thermal specification shown is the maximum case temperature at the maximum Thermal Design Power (TDP) value for that processor. It is measured at the geometric center on the topside of the processor integrated heat spreader. For processors without integrated heat spreaders such as mobile processors, the thermal specification is referred to as the junction temperature (Tj). The maximum junction temperature is defined by an activation of the processor IntelŪ Thermal Monitor. The Intel Thermal Monitor’s automatic mode is used to indicate that the maximum TJ has been reached.
Which is 61.4°C for the E6400.
Now I came across a post (I did a quick look in my bookmarks but I guess I forgot to bookmark it, still might be able to find it) where a user placed a temperature sensor directly on top of the IHS. This sensor was designed to be placed between the heat sink and cpu. Ran some tests. And the temperature that came off the IHS was pretty much exactly the same as the cores.
So hitting 61c in the cores means 61c on the IHS.
Hitting 75c on the cores means 75c on the IHS which means 14c over Intel's rated limit.
Unless I am miss understanding something here?
Ps I use core temp. Nivida monitoring software doesn't even work. I can't even use it to check my nvidia video card temps. Nvidia monitor says its runs at a constant 53c idle and under load.
__________________E6400 @ 3200 mhz (400x8) 1.45v || 2x 8800 GT || OCZ 600Watt sli || 22" LG Flatron
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