Originally Posted by Viral
Not disagreeing, but SB-E is still 32nm, there is no die shrink.
For the record though, a die shrink can certainly make a chip draw more power than a previous generation if leakage is excessive. This is pretty much almost always a given for the first few steppings on a new node... usually they will continue with revisions until they get the leakage and other problems under control before releasing retail chips. All of that is irrelevant to this thread though
My bad. Thought SNB-E was going to be on 22nm.